- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/06 - Containers; Seals characterised by the material of the container or its electrical properties
Patent holdings for IPC class H01L 23/06
Total number of patents in this class: 391
10-year publication summary
25
|
32
|
28
|
35
|
25
|
28
|
25
|
21
|
20
|
3
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Infineon Technologies AG | 8189 |
16 |
Texas Instruments Incorporated | 19376 |
14 |
Kyocera Corporation | 12735 |
13 |
Mitsubishi Electric Corporation | 43934 |
11 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
10 |
International Business Machines Corporation | 60644 |
9 |
Intel Corporation | 45621 |
9 |
Skyworks Solutions, Inc. | 3450 |
9 |
Fuji Electric Co., Ltd. | 4750 |
8 |
Murata Manufacturing Co., Ltd. | 22355 |
7 |
Nepes Co., Ltd. | 67 |
7 |
Hitachi Metals, Ltd. | 2175 |
6 |
STMicroelectronics S.r.l. | 3693 |
6 |
Jcet Semiconductor (shaoxing) Co., Ltd. | 366 |
6 |
Samsung Electronics Co., Ltd. | 131630 |
5 |
Renesas Electronics Corporation | 6305 |
5 |
Shinko Electric Industries Co., Ltd. | 1186 |
5 |
Infineon Technologies Americas Corp. | 768 |
5 |
STATS ChipPAC Pte. Lte. | 1516 |
5 |
Avago Technologies International Sales Pte. Limited | 9260 |
5 |
Other owners | 230 |